Shield can assembly and electronic device including the same

ABSTRACT

An electronic device includes a printed circuit board (PCB), a first cover disposed to shield a first region of the PCB, and a second cover for shielding a second region which has at least a boundary with the first region. A corresponding boundary portion the first cover and the second cover include at least one protrusion portion and at least one recess portion which are fitted to face each other. Thus, since at least two shielding covers share the single boundary region, the component mounting region of the PCB can be efficiently utilized to thus contribute to slimness of the electronic device.

CROSS-REFERENCE TO RELATED APPLICATION(S) AND CLAIM OF PRIORITY

The present application is related to and claims the benefit under 35U.S.C. §119(a) to a Korean patent application filed in the KoreanIntellectual Property Office on Jun. 11, 2013, and assigned Serial No.10-2013-0066249, the entire disclosure of which is hereby incorporatedby reference.

TECHNICAL FIELD

The present disclosure relates generally to a shield can assembly. Moreparticularly, the present disclosure relates to an electronic deviceincluding a shield can assembly.

BACKGROUND

In general, an electronic device can include a printed circuit board(PCB) of various types as the electronic device's main board. Diverseelectronic function groups can be mounted on the PCB for variousfunctions of the electronic device. When the electronic function groupoperates, it can emit a harmful wave. Hence, an electromagnetic waveemitted by the electronic device is severely restricted.

The electromagnetic wave of the harmful wave is most common, and anelectromagnetic compatibility (EMC) test is conducted to test whetherthe electromagnetic wave is acceptable in the environment.

The EMC test is divided into an electromagnetic interference (EMI) testand an electromagnetic susceptibility (EMS) test, which are strictlyregulated due to its harmfulness to the human body. Accordingly, manydevices are suggested to prevent in advance the electromagnetic wave inthe electronic function group according to the strict regulation of theEMI test.

To shield the electromagnetic wave radiated by the electronic functiongroup on the PCB of the electronic device, a paint is spread using anEMI spray or vacuum deposition or one or more shield cans are mounted toshield one or more electronic function groups on the PCB.

While such methods are redundantly used, the shield can isindispensable. Various methods are suggested to mount the shield can onthe PCB, which is largely divided into a mechanical coupling method, aclip-type coupling method, and a frame-type coupling method.

The mechanical coupling method fastens the shield can and the PCB usinga plurality of screws. The clip-type coupling method mounts a clip alongan outer rim of the shield can to electrically connect with a groundline of the PCB and then secures the shield can to the clip. Theframe-type coupling method installs a separate frame to surround thecomponents of the PCB and secures the shield can to the frame.

While the electronic device adds more various functions in response touser's wants, the electronic device's size is miniaturized and slimmed.Hence, the structure for securing the shield can which is indispensibleto shield the harmful wave from the electronic function groups is underdiscussion in many aspects in view of efficient space usage.

SUMMARY

To address the above-discussed deficiencies, it is a primary aspect ofthe present disclosure to provide a shield can assembly and anelectronic device having it.

Another aspect of the present disclosure is to provide a shield canassembly for contributing to slimness by enhancing space usage, and anelectronic device having it.

Yet another aspect of the present disclosure is to provide a shield canassembly for mounting more electronic function groups on a PCB, and anelectronic device having it.

According to one aspect of the present disclosure, an electronic deviceincludes a printed circuit board (PCB); a first cover disposed to shielda first region of the PCB; and a second cover for shielding a secondregion which has at least a boundary with the first region. Acorresponding boundary portion the first cover and the second cover mayinclude at least one protrusion portion and at least one recess portionwhich are fitted to face each other. The first cover and the secondcover may be disposed to cross their boundary surfaces. The shieldingcover may be a shield can be disposed on the PCB of the electronicdevice.

A portion of the first cover facing the second cover may be formed byalternating one or more protrusion portions and recess portions atregular intervals, and a portion of the second cover facing the firstcover may be formed by alternating one or more recess portions andprotrusion portions to be fitted with the protrusion portions and therecess portions of the first cover at corresponding positions. Any oneof the protrusion portion and the recess portion of the first cover andthe second cover may be formed to have a closed end.

The boundary portion of the first cover and the second cover may beformed to have a closed end in either cover.

The first cover and the second cover may include a top surface in a sizecorresponding to at least the first region and the second region; and aside surface bending along a rim of the top surface to a certain height.At least one side surface of the first and second covers is fitted inthe boundary portion. A depth of the fitted first and second covers maybe greater than, not greater than, or equal to a thickness of one of thefirst and second covers.

The electronic device may further include a ground line disposed to beexposed in a top surface of the PCB and having a certain width to form aboundary corresponding to rims of the first and second regions. Theelectronic device may further include a fixing means secured on theground line and fixing the first cover and the second cover. The fixingmeans may be a fixing clip which is disposed at regular intervals in theground line and comprises a side insertion portion for receiving sidesurfaces of the first cover and the second cover in a press-fit fashion.The fixing means may be a metal frame which is formed in the same shapeas the ground line to a certain height and secured such that sidesurfaces of the first cover and the second cover are tightly fitted inan inner side surface or an outer side surface. The side surface of thefirst cover and the second cover may be a plurality of tension ribsspaced at regular intervals, and the tension rib may be formed to pressan outer surface into the frame. The frame may be separated into a firstframe in a shape corresponding to the first region and a second frame ina shape corresponding to the second region. A boundary portion of thefirst region and the second region may be integrally formed with, atleast partially, the first frame and the second frame.

According to another aspect of the present disclosure, a shield canassembly includes a first cover mounted to shield a first region of aPCB; and a second cover for shielding a second region having at least aboundary with the first region. A corresponding boundary portion thefirst cover and the second cover may include at least one protrusionportion and at least one recess portion which are fitted to face eachother.

According to yet another aspect of the present disclosure, a PCBassembly includes a PCB for mounting a plurality of electronic functiongroups; a first cover mounted to shield the electronic function group ina first region of the PCB; and a second cover for shielding theelectronic function group in a second region having at least a boundarywith the first region. A corresponding boundary portion the first coverand the second cover may include at least one protrusion portion and atleast one recess portion which are fitted to face each other.

According to still another aspect of the present disclosure, anelectronic device includes a PCB for mounting a plurality of electronicfunction groups; a first region for accommodating part of the electronicfunction groups; a second region having at least a boundary portion withthe first region and accommodating part of the electronic functiongroups; a boundary line defining the first region and the second regionand electrically connected to a ground of the PCB; a first cover of ametal material mounted in the ground line to shield the first region; asecond cover of a metal material mounted in the ground line to shieldthe second region; and a fixing means of a conductive material forsecuring the first cover and the second cover to the first region andthe second region respectively. A corresponding boundary portion thefirst cover and the second cover may include at least one protrusionportion and at least one recess portion which are fitted to face eachother.

Other aspects, advantages, and salient features of the disclosure willbecome apparent to those skilled in the art from the following detaileddescription, which, taken in conjunction with the annexed drawings,discloses exemplary embodiments of the disclosure.

Before undertaking the DETAILED DESCRIPTION below, it may beadvantageous to set forth definitions of certain words and phrases usedthroughout this patent document: the terms “include” and “comprise,” aswell as derivatives thereof, mean inclusion without limitation; the term“or,” is inclusive, meaning and/or; the phrases “associated with” and“associated therewith,” as well as derivatives thereof, may mean toinclude, be included within, interconnect with, contain, be containedwithin, connect to or with, couple to or with, be communicable with,cooperate with, interleave, juxtapose, be proximate to, be bound to orwith, have, have a property of, or the like; and the term “controller”means any device, system or part thereof that controls at least oneoperation, such a device may be implemented in hardware, firmware orsoftware, or some combination of at least two of the same. It should benoted that the functionality associated with any particular controllermay be centralized or distributed, whether locally or remotely.Definitions for certain words and phrases are provided throughout thispatent document, those of ordinary skill in the art should understandthat in many, if not most instances, such definitions apply to prior, aswell as future uses of such defined words and phrases.

BRIEF DESCRIPTION OF THE DRAWINGS

For a more complete understanding of the present disclosure and itsadvantages, reference is now made to the following description taken inconjunction with the accompanying drawings, in which like referencenumerals represent like parts:

FIG. 1 illustrates an exploded view of a shield can assembly accordingto various exemplary embodiments of the present disclosure;

FIG. 2 illustrates a perspective view of covers of FIG. 1 according toan exemplary embodiment of the present disclosure;

FIG. 3 illustrates a perspective view of a first cover of FIG. 1, whichis taken from a different angle, according to an exemplary embodiment ofthe present disclosure;

FIG. 4 illustrates a plane view of the shield can assembly of FIG. 1fastened to a PCB according to an exemplary embodiment of the presentdisclosure;

FIG. 5 illustrates an exploded view of the shield can assembly accordingto various exemplary embodiments of the present disclosure; and

FIG. 6 illustrates a cross-sectional view of covers of FIG. 5 fastenedto the PCB using a frame according to an exemplary embodiment of thepresent disclosure.

Throughout the drawings, like reference numerals will be understood torefer to like parts, components and structures.

DETAILED DESCRIPTION

FIGS. 1 through 6, discussed below, and the various embodiments used todescribe the principles of the present disclosure in this patentdocument are by way of illustration only and should not be construed inany way to limit the scope of the disclosure. Those skilled in the artwill understand that the principles of the present disclosure may beimplemented in any suitably arranged system or device. The followingdescription with reference to the accompanying drawings is provided toassist in a comprehensive understanding of exemplary embodiments of thedisclosure as defined by the claims and their equivalents. It includesvarious specific details to assist in that understanding but these areto be regarded as merely exemplary. Accordingly, those of ordinary skillin the art will recognize that various changes and modifications of theembodiments described herein can be made without departing from thescope and spirit of the disclosure. In addition, descriptions ofwell-known functions and constructions may be omitted for clarity andconciseness.

The terms and words used in the following description and claims are notlimited to the bibliographical meanings, but, are merely used by theinventor to enable a clear and consistent understanding of thedisclosure. Accordingly, it should be apparent to those skilled in theart that the following description of exemplary embodiments of thepresent disclosure is provided for illustration purpose only and not forthe purpose of limiting the disclosure as defined by the appended claimsand their equivalents.

It is to be understood that the singular forms “a,” “an,” and “the”include plural referents unless the context clearly dictates otherwise.Thus, for example, reference to “a component surface” includes referenceto one or more of such surfaces.

By the term “substantially” it is meant that the recited characteristic,parameter, or value need not be achieved exactly, but that deviations orvariations, including for example, tolerances, measurement error,measurement accuracy limitations and other factors known to those ofskill in the art, may occur in amounts that do not preclude the effectthe characteristic was intended to provide.

Hereinafter, an electronic device can be applied to various devicesincluding a Printed Circuit Board (PCB) for mounting a plurality ofelectronic function groups. For example, the electronic device canemploy various devices including a touch screen, that is, variousdevices such as Personal Digital Assistant (PDA), laptop computer,mobile phone, smart phone, netbook, Mobile Internet Device (MID), UltraMobile PC (UMPC), tablet PC, a navigation, and MP3 player.

The PCB can be of, but not limited to, a rigid type or a flexible type.Even when the PCB is not included in the electronic device, the presentdisclosure is applicable to shield cans for shielding the electronicfunction group.

Herein, the term ‘engage’ can indicate that a protrusion formed in afirst object is fit into a recess portion formed in a second object toshare the facing boundary portion. FIG. 1 illustrates an exploded viewof a shield can assembly according to various exemplary embodiments ofthe present disclosure. While two shielding covers are depicted in FIG.1, two or more shielding covers may be applied to a single PCB.

Referring to FIG. 1, the shield can assembly 1 can include a PCB 4including a ground line 41, two covers 2 and 3 electrically connected tothe ground line 41 to shield electronic function groups 42 mounted onthe PCB 4, and a fixing means for fixing the covers 2 and 3 on the PCB4.

The ground line 41 formed or mounted on the PCB 4 is disposed to beexposed on a top surface of the PCB 4, and can be electrically connectedto a ground portion of the PCB 4. The ground line 41 can include anenclosed portion corresponding to a rim of the two covers 2 and 3disposed on the ground line 41. The ground line 41 can include a firstregion A for accommodating the electronic function group 42 in a closedshape, and a second region B for accommodating the electronic functiongroup 42 in a closed shape. The first region A can be formed by a firstground line 411, and the second region B can be formed by a secondground line 412. In addition, the first ground line 411 and the secondground line 412 can be divided into the first region A and the secondregion B based on a boundary ground line 413.

The covers 2 and 3 can include the first cover 2 and the second cover 3.The two covers 2 and 3 can be used to split and shield the electronicfunction groups 42 mounted on the PCB 4.

The first cover 2 can be secured to shield the first region A of the PCB4. The first cover 2 can be fixed to electrically connect to the firstground line 411 of the PCB 4 which defines the first region A with thefirst cover's 2 rim. The second cover 3 can be secured to shield thesecond region B of the PCB 4. The second cover 3 can be fixed toelectrically connect to the second ground line 412 which defines thesecond region B with the second cover's 3 rim.

The first cover 2 can include a top surface 21 formed in at least thesame size as the first region A, and a side surface 22 bending along therim of the top surface 21 to a certain height. Hence, a space formed bythe side surface 22 of the certain height from the top surface 21 can beused as an accommodation space for receiving the electronic functiongroups 42 when the first cover 2 is secured to the PCB 4.

The second cover 3 can include a top surface 31 formed in at least thesame size as the second region B, and a side surface 32 bending alongthe rim of the top surface 31 to a certain height. Hence, a space formedby the side surface 32 of the certain height from the top surface 31 canbe used as an accommodation space for receiving the electronic functiongroups 42 when the second cover 3 is secured to the PCB 4.

The first cover 2 and the second cover 3 can be formed of a metalmaterial. For example, the first cover 2 and the second cover 3 can beformed of a conductive metal material such as SUS and aluminum. In thiscase, the top surfaces 21 and 31, the side surfaces 22 and 32, a tensionprotrusion 321, to be explained, can be formed integrally using pressingor injection molding.

The fixing means can employ a fixing clip 8 for tightly receiving theside surfaces 21 and 31 of the covers 2 and 3. The fixing clip 8 can beformed by bending a metal plate several times, and be fixed to theground line 41 of the PCB 4. The fixing clip 8 can include a sideinsertion portion 81 with an open upper surface to tightly receive theside surfaces 21 and 31 of the covers 2 and 3. For example, at least onetension protrusion 321 formed in the side surface 32 of the covers 2 and3 is press-fitted to a tension hole 82 of the side insertion portion 81of the fixing clip 8, to thus securely fix the covers 2 and 3 to the PCB4 without separation. For example, the fixing clip 8 can be formed of ametal material and secured to the ground line 411 of the PCB 4 usingsoldering or bonding.

For example, the fixing clip 8 may be mounted to the boundary groundline 413 which is the boundary of the first region A and the secondregion B. In this case, the fixing clip 8 can be applied to protrusionportions 23 and 33 including a closed end of the first cover 2 and thesecond cover 3. For example, when recess portions of the first cover 2and the second cover 3 include the closed end, the fixing clip 8 may beapplied to the corresponding recess portion. For example, when therecess portion and the protrusion portion of the first cover 2 and thesecond cover 3 share the closed end, the fixing clip 8 may be disposedto accommodate both of the first cover 2 and the second cover 3.

For example, the boundary ground line 413 of the PCB 4 can accommodateboth of the two covers 2 and 3. The corresponding side surfaces 22 and32 of the first cover 2 and the second cover 3 can face each other, andthe facing portion can be received in the single boundary ground line413. Such a structure is very advantageous to the space usage. Themounting space of the electronic function group can be extended or thetotal volume of the shield can assembly 1 can be reduced compared to therelated art which applies the individual ground line corresponding tothe covers 2 and 3 respectively. Thus, the device can be slimmed.

When the two shielding covers are adjacent and their corresponding sidesurfaces face each other in the related art, the facing portion of thecovers has the boundary portion to a thickness corresponding to thesides of the two covers. By contrast, when the two covers face eachother, the present disclosure has the boundary portion to the thicknesscorresponding to the single cover side, which is greatly advantageous.

For example, the facing boundary portion of the first cover 2 and thesecond cover 3 can be formed by alternating the protrusion portions 23and 33 and the recess portions 24 and 34. Hence, the first cover 2 andthe second cover 3 can be tightly coupled by facing and engaging eachother at the same time. For example, when the protrusion portion 23 andthe recess portion 24 are alternated in the first cover 2, the secondcover 3 can alternate the corresponding recess portion 34 and thecorresponding protrusion portion 33. Accordingly, the protrusion portion33 of the second cover 3 is inserted to the recess portion 24 of thefirst cover 2 and the protrusion portion 23 of the first cover 2 isinserted to the recess portion 34 of the second cover 3 so that thefirst cover 2 and the second cover 3 tightly face each other without anyseparation.

For example, since the engaged portion of the protrusion portions 23 and33 and the recess portions 24 and 34 of the first cover 2 and the secondcover 3 is electrically connected with the boundary ground line 413 ofthe PCB 4, the single cover thickness can realize the width of theboundary ground line 413.

For example, when the protrusion portions 23 and 33 and the recessportions 24 and 34 of the first cover 2 and the second cover 3 face eachother, at least one corresponding portion can be formed as a closed endto easily separate the first region A and the second B 2. Since theprotrusion portions 23 and 33 and the recess portions 24 and 34 of thefirst cover 2 and the second cover 3 clearly separate the first region Aand the second region B, the separate boundary ground line 413 may notbe formed.

FIG. 2 illustrates a perspective view of the covers of FIG. 1 accordingto an exemplary embodiment of the present disclosure, and FIG. 3illustrates a perspective view of the first cover of FIG. 1, which istaken from a different angle, according to an exemplary embodiment ofthe present disclosure.

Referring to FIGS. 2 and 3, the first cover 2 can include a pair of theprotrusion portions 23 spaced from each other at a certain distance, anda pair of the recess portions 24 between the protrusion portions 23.Likewise, the second cover 3 can include a pair of the recess portions34 spaced from each other at a certain distance, and a pair of theprotrusion portions 33 between the recess portions 33.

For example, the protrusion portion 23 of the first cover 2 cancorrespond to the recess portion 34 of the second cover 3, and therecess portion 24 of the first cover 2 can correspond to the protrusionportion 33 of the second cover 3. The protrusion portion 23 of the firstcover 2 and the protrusion portion 33 of the second cover 3 can bend andprotrude to have the closed end. The recess portion 24 of the firstcover 2 and the recess portion 34 of the second cover 3 can form an openend. Hence, when the protrusion portions 23 and 33 and the recessportions 24 and 34 of the first cover 2 and the second cover 3 areengaged, the closed end of the protrusion portions 23 and 33 of thefirst cover 2 and the second cover 3 can shield and separate theelectronic function group receiving space of the first cover 2 and theelectronic function group receiving space of the second cover 3.

For example, the recess portions 24 and 34 of the first cover 2 and thesecond cover 3 may include the closed end, and the correspondingprotrusion portions 23 and 33 of the first cover 2 and the second cover3 may include the closed end. For example, both of the recess portion 24and the protrusion portion 23 of the first cover 2 may include theclosed end, and both of the recess portion 34 and the protrusion portion33 of the second cover 3 may include the open end. For example, it isadvantageous that at least one of the recess portion 24 or theprotrusion portion 23 of the first cover 2 and the protrusion portion 33or the recess portion 34 of the second cover 3 includes the closed end.

FIG. 4 illustrates a plane view of the shield can assembly of FIG. 1fastened to the PCB according to an exemplary embodiment of the presentdisclosure.

Referring to FIG. 4, to separate and shield the electronic functiongroups 42 on the PCB 4, the first cover 2 and the second cover 3 for theshielding can be applied. In so doing, the PCB 4 can be divided by theground line 41 into two regions, and the electronic function groups 42can be mounted in the regions A and B. The ground line 41 includes thefirst ground line 411 for closing along the side surface of the firstcover 2, the second ground line 412 for closing along the side surfaceof the second cover 3, and the boundary ground line 413 for separatingthe first region A and the second region B. The boundary ground line 413can be formed along the facing portion of the first cover 2 and thesecond cover 3.

For example, the protrusion portions 23 of the first cover 2 and theprotrusion portions 33 of the second cover 3 can engage and face eachother. In so doing, since the protrusion portions 23 and 33 of thecovers 2 and 3 are the closed ends, the closed ends of the protrusionportions 23 and 33 can be connected along the boundary ground line 413without ceasing as shown in FIG. 4. Thus, the first region A and thesecond region B can be completely separated along the boundary groundline 413.

When the first cover 2 and the second cover 3 face each other, theirfacing portions are engaged to thus result in no wide boundary widthincluding the thickness of the both covers 2 and 3. For example, thefacing portion of the first cover 2 and the second cover 33 can realizethe thickness of the single cover by virtue of their engaging structure.

FIG. 5 illustrates an exploded view of the shield can assembly accordingto various exemplary embodiments of the present disclosure.

For example, the shield can assembly may be realized as a frame fixingtype. The PCB including the ground line is substantially the same as inFIG. 1 and thus shall be omitted here.

Referring to FIG. 5, the shield can assembly 6 can include a frame 7fixed on the PCB at a certain height, and a first cover 5 and a secondcover 6 secured on the frame 7. It is advantageous that the frame 7 isformed of a metal material in the same shape as the ground line of thePCB, and secured to the ground line. The frame 7 can be secured toelectrically connect with the ground line of the PCB using the bondingor the soldering.

For example, the frame 7 can include a first frame 71 including a firstregion C for accommodating the electronic function groups, a secondframe 72 including a second region D for accommodating the electronicfunction groups, and a boundary frame 73 for separating the first regionC and the second region D. The frames 71, 72, and 73 can be integrallyformed. For example, the first frame 71 and the second frame 72 may beseparated from each other. In this case, the boundary frame 73 may beseparated at an adequate position and integrally formed with the firstframe 71 and the second frame 72.

When the frames are separated based on their region, the first andsecond frames 71 and 72 and the first and second covers 5 and 6 may bemounted on the PCB all together after spreading a resin. Such astructure is very advantageous to the process efficiency compared to therelated art which mounts the frame on the PCB and then assembles thecover on them. For example, the boundary frame 73 can alternate, but notlimited to, a receiving groove for receiving protrusion portions 53 and63 of the first cover 5 and the second cover 6 at regular intervals. Theboundary frame 73 may be formed in a straight-line shape.

The first cover 5 can include a top surface 51, and a plurality oftension ribs 52 bending from the top surface 51 and formed in a certainheight at regular intervals along a rim of the top surface 51. Thetension rib 52 can secure the first cover 5 by contacting an outer sidesurface of the first frame 71. The tension rib 52 includes a protrusion(not shown) and the first frame 71 includes a protrusion receivinggroove (not shown) at a corresponding position. Hence, the protrusion isinserted to the protrusion receiving groove so that the first cover 5 issupported and secured by the first frame 71.

The second cover 6 can include a top surface 61, and a plurality oftension ribs 62 bending from the top surface 61 and formed in a certainheight at regular intervals along a rim of the top surface 61. Thetension rib 62 can secure the second cover 6 by contacting an outer sidesurface of the second frame 72. The tension rib 62 includes a protrusion(not shown) and the second frame 72 includes a protrusion receivinggroove (not shown) at a corresponding position. Hence, the protrusion isinserted to the protrusion receiving groove so that the second cover 6is supported and secured by the second frame 72.

For example, the first cover 5 and the second cover 6 can be disposed toface each other. The protrusion portion 53 and the recess portion 54 canbe alternated in the portion of the first cover 5 facing the secondcover 6, and the protrusion portion 63 and the recess portion 64 can bealternated in the portion of the second cover 6 facing the first cover5. Likewise, the protrusion portions 53 and 63 and the recess portions54 and 64 of the first cover 5 and the second cover 6 can be disposedand engaged at the corresponding positions. That is, the protrusionportion 63 can be formed at the position of the second cover 6corresponding to the recess portion 54 of the first cover 5, and therecess portion 54 of the first cover 5 and the protrusion portion 63 ofthe second cover 6 can be engaged. The recess portion 64 can be formedat the position of the second cover 6 corresponding to the protrusionportion 53 of the first cover 5, and the protrusion portion 53 of thefirst cover 5 and the recess portion 64 of the second cover 6 can beengaged.

For example, the protrusion portions 53 and 63 of the first cover 5 andthe second cover 6 can be formed as a plurality of tension ribs spacedat regular intervals. The protrusion portions 53 and 63 of the firstcover 5 and the second cover 6 can bend in the same fashion as thetension ribs 52 and 62 formed on the side surface of the first cover 5and the second cover 6.

FIG. 6 illustrates a cross-sectional view of the covers of FIG. 5fastened to the PCB using the frame according to an exemplary embodimentof the present disclosure.

Referring to FIG. 6, the frame 7 of the certain height can be mounted onthe PCB. The frame 7 includes the first frame 71 for creating the firstregion C to mount the electronic function groups and to receive thefirst cover 5, and the second region D for mounting the electronicfunction groups and receiving the second cover 6. The boundary frame 73can be formed to isolate the first region C and the second region D.

For example, the first cover 5 can be disposed on the first frame 71 andthen secured to the first frame 5 with a certain pressure. For example,the tension ribs 52 serving as the side surface of the first cover 5 canbe tightly contacted and secured to the outer surface of the first frame5. Likewise, the second cover 6 can be disposed on the second frame 72and then secured to the second frame 72 with a certain pressure. Forexample, the tension ribs 62 serving as the side surface of the secondcover 6 can be tightly contacted and secured to the outer surface of thesecond frame 6.

For example, the protrusion portions 53 and 63 of the first cover 5 andthe second cover 6 can be engaged with the corresponding recess portions54 and 64 to face each other. Thus, the protrusion portion 53 of thefirst cover 5 can be secured toward the second region being the outersurface of the boundary frame 73, and the protrusion portion 63 of thesecond cover 6 can be secured toward the first region being the outersurface of the boundary frame 73.

For example, although the tension ribs 52 and 62 of the covers 5 and 6and the protrusion portions 53 and 63 of the first and second covers 5and 6 include the tension ribs, the side surface of each region isshielded already by the frame 7 due to the certain height. Thus, thefirst region C and the second region D can function as the completeshielding space thanks to the top surfaces of the first cover 5 and thesecond cover 6.

As set forth above, since at least two shielding covers share the singleboundary region, the component mounting region of the PCB can beefficiently utilized to thus contribute to the slimness of theelectronic device.

While the disclosure has been shown and described with reference tocertain exemplary embodiments thereof, it will be understood by thoseskilled in the art that various changes in form and details may be madetherein without departing from the spirit and scope of the disclosure asdefined by the appended claims and their equivalents.

1-20. (canceled)
 21. An electronic device comprising: at least oneprinted circuit board (PCB) including a first region and a second regionadjacent to the first region; a first electronic element disposed in thefirst region; a second electronic element disposed in the second region;a first cover configured to shield the first electronic element, thefirst cover including at least one protrusion portion and at least onerecess portion; and a second cover configured to shield the secondelectronic element, the second cover including at least one protrusionportion configured to be fitted into the at least one recess portion ofthe first cover and at least one recess portion, wherein the at leastone protrusion portion of the first cover is configured to be fittedinto the at least one recess portion of the second cover.
 22. Theelectronic device of claim 21, wherein the at least one protrusionportion of the first cover and the at least one protrusion portion ofthe second cover have sizes and shapes corresponding to the at least onerecess portion of the second cover and the at least one recess portionof the first cover, respectively, so as to fit within the at least onerecess portion of the second cover and the at least one recess portionof the first cover, respectively.
 23. The electronic device of claim 21,wherein: the at least one protrusion portion and the at least one recessportion of the first cover are positioned next to each other along anedge of the first cover, the at least one protrusion portion and the atleast one recess portion of the second cover are positioned next to eachother along an edge of the second cover, and when disposed on the atleast one PCB to cover respective electronic elements, the edge of thesecond cover is positioned next to the edge of the first cover.
 24. Theelectronic device of claim 23, wherein at least one of the protrusionportions and recess portions of the first and second covers is formed tohave a closed end.
 25. The electronic device of claim 23, wherein thefirst cover and the second cover, when fitted together, comprise: a topsurface in a size corresponding to at least the first region and thesecond region; and a side surface along a boundary between the firstregion and the second region, wherein the side surface is formed byportions of both of the first cover and the second cover.
 26. Theelectronic device of claim 23, wherein the first cover includes oneprotrusion portion and two recessed portions and the second coverincludes two protrusion portions and one recessed portion.
 27. Theelectronic device of claim 23, wherein, when the first cover and thesecond cover are fitted together, the one protrusion portion of thefirst cover is fitted in the one recessed portion of the second coverand positioned between the two protrusion portions of the second cover.28. The electronic device of claim 21, wherein a boundary between thefirst region and the second region is covered by at least one protrusionportion of both the first cover and the second cover.
 29. The electronicdevice of claim 21, wherein the first cover and the second cover have atleast one common ground portion.
 30. The electronic device of claim 21,wherein the electronic device is a mobile phone.
 31. A shield assemblycomprising: a first cover configured to shield one or more electronicelements disposed on a first region of a printed circuit board (PCB),the first cover including at least one protrusion portion and at leastone recess portion; and a second cover configured to shield one or moreelectronic elements disposed on a second region of the PCB, the secondcover including at least one protrusion portion configured to be fittedinto the at least one recess portion of the first cover and at least onerecess portion, wherein the at least one protrusion portion of the firstcover is configured to be fitted into the at least one recess portion ofthe second cover.
 32. The shield assembly of claim 31, wherein the atleast one protrusion portion of the first cover and the at least oneprotrusion portion of the second cover have sizes and shapescorresponding to the at least one recess portion of the second cover andthe at least one recess portion of the first cover, respectively, so asto fit within the at least one recess portion of the second cover andthe at least one recess portion of the first cover, respectively. 33.The shield assembly of claim 32, wherein: the at least one protrusionportion and the at least one recess portion of the first cover arepositioned next to each other along an edge of the first cover, the atleast one protrusion portion and the at least one recess portion of thesecond cover are positioned next to each other along an edge of thesecond cover, and when disposed on the at least one PCB to coverrespective electronic elements, the edge of the second cover ispositioned next to the edge of the first cover.
 34. The shield assemblyof claim 33, wherein at least one of the protrusion portions and recessportions of the first and second covers is formed to have a closed end.35. The shield assembly of claim 33, wherein the first cover and thesecond cover, when fitted together, comprise: a top surface in a sizecorresponding to at least the first region and the second region; and aside surface along a boundary between the first region and the secondregion, wherein the side surface is formed by portions of both of thefirst cover and the second cover.
 36. The shield assembly of claim 33,wherein the first cover includes one protrusion portion and two recessedportions and the second cover includes two protrusion portions and onerecessed portion.
 37. The shield assembly of claim 33, wherein, when thefirst cover and the second cover are fitted together, the one protrusionportion of the first cover is fitted in the one recessed portion of thesecond cover and positioned between the two protrusion portions of thesecond cover.
 38. The shield assembly of claim 31, wherein a boundarybetween the first region and the second region is covered by at leastone protrusion portion of both the first cover and the second cover. 39.The shield assembly of claim 21, wherein the first cover and the secondcover have at least one common ground portion.
 40. An electronic devicecomprising: at least one printed circuit board (PCB) including a firstregion and a second region adjacent to the first region; a firstelectronic element disposed in the first region; a second electronicelement disposed in the second region; a first cover configured toshield the first electronic element, the first cover including aprotrusion portion and two recess portions; and a second coverconfigured to shield the second electronic element, the second coverincluding two protrusion portions configured to be fitted into the tworecess portions of the first cover, wherein: the protrusion portion ofthe first cover is configured to be fitted into the recess portion ofthe second cover, the protrusion portion of the first cover and the twoprotrusion portions of the second cover have sizes and shapescorresponding to the recess portion of the second cover and the tworecess portions of the first cover, respectively, the protrusion portionof the first cover is positioned between and the two recess portions ofthe first cover along an edge of the first cover, the recess portion ofthe second cover is positioned between the two protrusion portions ofthe second cover along an edge of the second cover, when disposed on theat least one PCB to cover respective electronic elements, the edge ofthe second cover is positioned next to the edge of the first cover. atleast one of the protrusion portions and recess portions of the firstand second covers is formed to have a closed end, when fitted together,the first cover and the second cover comprise: a top surface in a sizecorresponding to at least the first region and the second region, and aside surface along a boundary between the first region and the secondregion, wherein the side surface is formed by portions of both of thefirst cover and the second cover, and wherein a boundary between thefirst region and the second region is covered by at least one protrusionportion of both the first cover and the second cover.